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YIXUN mold
3926909090
These high-performance electronic component trays are precision-engineered using high-pressure injection molding from static-dissipative engineering plastics. Designed to protect and transport sensitive electronic parts, they deliver exceptional durability, dimensional accuracy, and reliable ESD (Electrostatic Discharge) protection for automated manufacturing environments.
High-Precision Injection Molding
Manufactured in a single high-pressure injection molding process, these trays feature uniform wall thickness, crisp, consistent details in every cavity, and integrated stacking locks. The one-piece construction eliminates weak points and ensures long-lasting performance, even under heavy industrial use.
Permanent ESD Protection
The static-dissipative additive is uniformly blended into the raw material during injection molding, providing a consistent surface resistance of 10⁶–10¹¹Ω across the entire tray. This permanent protection prevents electrostatic damage to sensitive components like ICs, LEDs, and connectors, without relying on a fragile surface coating that can wear off.
Automation-Ready Design
Precision-machined cavities with tight tolerances ensure secure component positioning, while the integrated stacking and locating features enable seamless integration with SMT pick-and-place machines and automated conveyor systems. This minimizes downtime and maximizes production efficiency.
Durable & Reusable
Made from impact-resistant ABS/PP plastic, these trays withstand repeated stacking, cleaning, and handling without warping or cracking. Their smooth, non-porous surface is easy to sanitize, making them a cost-effective, eco-friendly alternative to disposable packaging.
| Parameter | Details |
|---|---|
| Material | ESD-safe ABS/PP blend |
| Manufacturing Process | High-pressure injection molding |
| Surface Resistance | 10⁶–10¹¹Ω (static-dissipative) |
| Cavity Design | Customizable for components (round, rectangular, etc.) |
| Stackability | Yes, with integrated locking features |
| Compatibility | Fully compatible with SMT automation equipment |
| Operating Temperature | -20°C to 80°C |
Semiconductor Manufacturing: For transporting and storing wafers, IC chips, and packaged components.
LED & Optoelectronics: As a secure carrier for LED dies, optoelectronic sensors, and lens assemblies.
Consumer Electronics: For handling PCBs, connectors, and small modules during assembly.
Automotive Electronics: To protect sensitive automotive-grade components throughout the supply chain.
These high-performance electronic component trays are precision-engineered using high-pressure injection molding from static-dissipative engineering plastics. Designed to protect and transport sensitive electronic parts, they deliver exceptional durability, dimensional accuracy, and reliable ESD (Electrostatic Discharge) protection for automated manufacturing environments.
High-Precision Injection Molding
Manufactured in a single high-pressure injection molding process, these trays feature uniform wall thickness, crisp, consistent details in every cavity, and integrated stacking locks. The one-piece construction eliminates weak points and ensures long-lasting performance, even under heavy industrial use.
Permanent ESD Protection
The static-dissipative additive is uniformly blended into the raw material during injection molding, providing a consistent surface resistance of 10⁶–10¹¹Ω across the entire tray. This permanent protection prevents electrostatic damage to sensitive components like ICs, LEDs, and connectors, without relying on a fragile surface coating that can wear off.
Automation-Ready Design
Precision-machined cavities with tight tolerances ensure secure component positioning, while the integrated stacking and locating features enable seamless integration with SMT pick-and-place machines and automated conveyor systems. This minimizes downtime and maximizes production efficiency.
Durable & Reusable
Made from impact-resistant ABS/PP plastic, these trays withstand repeated stacking, cleaning, and handling without warping or cracking. Their smooth, non-porous surface is easy to sanitize, making them a cost-effective, eco-friendly alternative to disposable packaging.
| Parameter | Details |
|---|---|
| Material | ESD-safe ABS/PP blend |
| Manufacturing Process | High-pressure injection molding |
| Surface Resistance | 10⁶–10¹¹Ω (static-dissipative) |
| Cavity Design | Customizable for components (round, rectangular, etc.) |
| Stackability | Yes, with integrated locking features |
| Compatibility | Fully compatible with SMT automation equipment |
| Operating Temperature | -20°C to 80°C |
Semiconductor Manufacturing: For transporting and storing wafers, IC chips, and packaged components.
LED & Optoelectronics: As a secure carrier for LED dies, optoelectronic sensors, and lens assemblies.
Consumer Electronics: For handling PCBs, connectors, and small modules during assembly.
Automotive Electronics: To protect sensitive automotive-grade components throughout the supply chain.
